Construction |
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Conductor | Bare copper wire, Nom. ø 0.64 mm (AWG22) |
Insulation | Foam-Skin PE |
Twisting | 2 cores to the pair |
Cable lay up | 4 pairs |
Pair Screen | Al-laminated Plastic Foil around each pair |
Overall screen | Tinned Copper Braid |
Sheath | LSZH |
Outer diameter | Nom. 8.5 mm |
Mechanical properties |
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Bending radius | Installation | ≥ 8 X OD |
Installed | ≥ 4 X OD | |
Temperature range | During operation | -20°C to + 60°C |
During installation | 0°C to + 50°C |
Electrical properties |
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DC loop resistance | 110 Ω | ||
Insulation resistance | (500 V) | ≥ 5000 MΩ.km | |
Nominal Mutual Capacitance | Nom. 43 pF/m | ||
Mean Characteristic Impedance | @ 100 MHz | 100 Ω | |
Nominal velocity of propagation | Nom. 79% | ||
Max. Delay skew | 12 ns/100 m | ||
Transfer Impedance | At 1 MHz | 5 mΩ/m | |
Coupling Attenuation | 85 dB | ||
Attenuation @ 2000 Mhz | 78.1 dB | ||
NEXT @ 2000 Mhz | 75.0 dB | ||
PS-NEXT @ 2000 Mhz | 72.0 dB |
Ordering Information | |||
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SAP IC | Product Description | P.U | |
60030331 | UC FUTURE COMPACT22 Cat.8.2 S/FTP 4P LSHF-FR Dca | 500m/reel |